A World of Interconnect Solutions

Glenair Interconnect Solution Seminar Series

Glenair Interconnect Solution Seminar Series

Free On-Site Technical Seminars from the Glenair Factory: Hosted Lunch-and-Learns on Key Interconnect Design Topics—from weight reduction to EMI Filtering

The interconnect industry’s most innovative engineering and design team is just an e-mail away—ready to deliver the best technical seminar your staff will attend this year. Choose from eight new, cutting-edge interconnect seminars, or contact the factory to arrange a special session tailored to your exact requirements.

Download the brochure:
Glenair Interconnect Solutions Seminar Series Brochure [ 8 MB pdf ]
Interconnect Seminar No. 1
Interconnect Seminar No. 1

Design Innovations Guaranteed To Advance Interconnect System Performance

This survey-level seminar covers:
  • Connector Miniaturization
  • System Weight Reduction
  • EMI Filtering and Shielding
  • Advanced Environmental Sealing
  • High-Speed Interconnections
Interconnect Seminar No. 2
Interconnect Seminar No. 2

Cost-Effective Size And Weight Reduction In Interconnect Systems

This in-depth seminar covers:
  • Composite thermoplastics
  • Micro-filament cable shield termination processes and technologies
  • Connector Miniaturization
  • Contact density optimization
Interconnect Seminar No. 3
Interconnect Seminar No. 3

Protecting Electronic Equipment From Costly Environmental Damage With Advanced Connector Sealing Technologies

This in-depth seminar covers:
  • Environmental connector classes and duties
  • Materials selection for maximum durability
  • Metal-to-glass hermetics
  • Submersible/Marine solutions
  • Accessory sealing solutions
  • CBRN qualified components
Interconnect Seminar No. 4
Seminar No. 4

Fast, Effective And Proven Solutions To Electromagnetic Interference

This in-depth seminar covers:
  • EMI/EMC Basics
  • EMC Design Strategies and Solutions
  • Cost Effective EMC Technologies
  • Connector Filtering as a Design Solution
  • EMP Connector and Box Solutions
Interconnect Seminar No. 5
Seminar No. 5

Integration Of Ethernet And Other High-Speed Data Bus Protocols In Mission-Critical Applications

This survey-level seminar covers:
  • Data bus protocols
  • High-speed MS circulars
  • USB/RJ field solutions
  • Alternatives to standard ethernet connectors
  • Optimizing contact/wire performance
Interconnect Seminar No. 6
Seminar No. 6

Optimizing Bandwidth, Speed And Security With Fiber Optic Technologies

This in-depth seminar covers:
  • Fiber optic data-link technology
  • Singlemode vs. multimode
  • Termini design protocols
  • Fiber optic interconnect system design
  • Innovation in expanded-beam systems
Interconnect Seminar No. 7
Seminar No. 7

Designing Performance Into Interconnect Cables—From The Ground Up

This in-depth seminar covers:
  • Factors that impact cable design and construction
  • Strengths and weaknesses of available cable design options
  • Practical application checklist for cable designers
  • Glenair's cable design, construction and testing capabilities
Interconnect Seminar No. 8
Seminar No. 8

Taking Advantages Of The Strengths And Weaknesses Of Composite Thermoplastic Interconnect Systems

This in-depth seminar covers:
  • Composite thermoplastic material science
  • Weight savings and corrosion resistance
  • Composite thermoplastics and lightning strike
  • Qualifications and performance benchmarks
  • Next-generation composite interconnect technologies